The GO link is the missing link for your music experience. On the one hand, it allows you to connect wired headphones and earphones to digital devices that do not have a 3.5 mm headphone output. For another: Even if your device has a headphone jack, the GO link enables a significant sonic upgrade. That's because the GO link's DAC (digital-to-analogue converter) and headphone amplifier are superior to the audio technology in mobile devices and computers and can generate better sound quality. There is a USB-C connector at one end of the GO link and a 3.5 mm headphone jack at the other, both housed in a lightweight case made from a robust magnesium alloy. In between is a 6 cm long, flexible cable that bends easily. At the heart of the GO link is an energy-efficient, high-performance DAC chip from ESS Technology's Sabre HiFi series, which, together with iFi's optimised circuit technology, delivers ultra-low distortion, superb clarity and impressive dynamic range. Unlike other headphone dongles, the GO link features a hardware-based volume control rather than a software-based volume control, which contributes to the GO link's superior sonic performance. The GO link delivers an output power of 70 mW, which is enough to drive mobile device compatible headphones and earphones and far exceeds the headphone outputs of smartphones, tablets and computers.